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The tin absorbing wire should be used when soldering IC and other components, the tin adhered to the pin can be sucked away. Ensuring that there is no short circuit between pins.
In addition, the solder wire is used to clean the solder pad of the BGA element during ball planting, which greatly increases the success rate of ball planting.
- It is made of pure copper and special chemicals to ensure good, fast and economical use.
- Used to absorb excess solder when removing tin, it is resistant to oxidation and corrosion, thermal conductivity and tinning effect are very good, suction tin clean.
- Width: 2.5mm
- Weight: 8.1 grams
- Length: 1.5 meters
- Purpose: Clean up excess tin on PCB pads
|Shipping Weight||20 grams|
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